Advanced Packaging Solutions
As the core component of semiconductor packaging, IC packaging substrates are undergoing multiple transformations, including material iteration, process upgrading and expansion of application scenarios.
The new complete set of laser solutions we developed for the advanced packaging industry can be used for the processing of advanced packaging such as FC-CSP, FC-BGA, glass substrate, EMIB and FOPLP.The downstream application scenarios mainly include CPU, GPU, FPGA and ASIC for smartphones SoC, AiP, and AI computing power servers.
They are all partnering with us.
We serve leading PCB enterprises worldwide, covering the top 100 PCB manufacturers in China, and gaining customer recognition with technology and quality.
Ranking is not in any particular order